Design for the Innovation
We stay ahead of the curve by continuously exploring new technologies and methodologies. (MCP : Multi-Chip Package , currently including SOP-4/ASOP-6/ASOP-7/HSOP-7/HSOP-8/ESOP-10W/SOP-16)
We stay ahead of the curve by continuously exploring new technologies and methodologies. (MCP : Multi-Chip Package , currently including SOP-4/ASOP-6/ASOP-7/HSOP-7/HSOP-8/ESOP-10W/SOP-16)